Power chips are connected to exterior circuits through product packaging, and their performance depends upon the assistance of the packaging. In high-power scenarios, power chips are usually packaged as power components. Chip affiliation describes the electrical connection on the upper surface area of the chip, which is normally light weight aluminum bonding cable in typical modules. ^
Conventional power module package cross-section

Today, business silicon carbide power components still mainly utilize the packaging modern technology of this wire-bonded typical silicon IGBT component. They face problems such as big high-frequency parasitic criteria, not enough warmth dissipation ability, low-temperature resistance, and insufficient insulation toughness, which restrict the use of silicon carbide semiconductors. The display screen of superb efficiency. In order to solve these problems and completely exploit the massive prospective benefits of silicon carbide chips, many brand-new packaging innovations and services for silicon carbide power modules have actually arised in the last few years.

Silicon carbide power component bonding technique

(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)

Bonding products have actually created from gold wire bonding in 2001 to aluminum wire (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power tools have established from gold cables to copper cables, and the driving force is expense reduction; high-power gadgets have developed from aluminum cables (strips) to Cu Clips, and the driving pressure is to boost product performance. The better the power, the higher the requirements.

Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging process that utilizes a strong copper bridge soldered to solder to attach chips and pins. Compared to traditional bonding packaging approaches, Cu Clip innovation has the complying with benefits:

1. The connection in between the chip and the pins is made from copper sheets, which, to a specific extent, replaces the basic cord bonding technique between the chip and the pins. Therefore, an unique package resistance worth, higher existing flow, and better thermal conductivity can be obtained.

2. The lead pin welding area does not need to be silver-plated, which can totally save the cost of silver plating and inadequate silver plating.

3. The item appearance is entirely constant with normal items and is generally made use of in servers, mobile computer systems, batteries/drives, graphics cards, motors, power materials, and various other fields.

Cu Clip has two bonding methods.

All copper sheet bonding approach

Both eviction pad and the Resource pad are clip-based. This bonding approach is a lot more expensive and complex, however it can achieve much better Rdson and much better thermal impacts.

( copper strip)

Copper sheet plus cord bonding technique

The source pad utilizes a Clip method, and eviction uses a Cord method. This bonding method is a little more affordable than the all-copper bonding technique, saving wafer location (relevant to really tiny gate areas). The process is easier than the all-copper bonding approach and can obtain better Rdson and much better thermal result.

Supplier of Copper Strip

TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding silver on copper, please feel free to contact us and send an inquiry.

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